Guide

Thermal and Mechanical Design
Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family 17
Thermal/ Mechanical Specifications and Design Guide
2.1.2 LGA2011-1 Socket Mechanical Specifications
2.1.2.1 Socket Overview
This section describes a surface mount LGA (Land Grid Array) socket that provides I/O,
power, and ground contacts. The socket has two main components, the socket body
and Pick and Place (PnP) cover. They are delivered by the socket supplier as a single
integral assembly. The main body of the socket, which is made of electrically insulated
material with resistance to high temperature, houses the socket contacts. Key
components of the socket are the main body of the socket, socket contacts, surface
mount features, and protective cover and its keying features. Figure 2-5 illustrates
the socket features. Keying features (wall protrusions) within the contact array area
and raised edges of the socket body help align the package with respect to the
socket contacts.
2.1.2.2 Socket Features
LGA2011-1 socket contacts are in 1.016 mm (0.040”) hexagonal pitch in a 58 x 43 grid
array with 24x16 grid depopulation in the center of the array and selective
depopulation elsewhere, see Appendix F. The tips of the contacts will extend beyond
the surface of the socket to make contact with the pads located at the bottom of the
processor package.
Figure 2-5. LGA2011-1 Socket with Cover
Table 2-3. LGA2011-1 Socket Attributes
LGA2011-1 Socket Attributes
Component Size 58.5 mm (L) x 51 mm (W)
Pitch 1.016 mm (Hex Array)
Ball Count 2011
Pick and Place
(PnP) Cover
LGA2011-1 Socket
Pick and Place
(PnP) Cover
LGA2011-1 Socket