Guide

Reference Thermal Solutions
R
Intel
®
E7500/E7501/E7505 Chipset MCH Thermal Design Guide 23
6.3 Thermal Solution Assembly
The reference thermal solution for the E7500/E7501/E7505 MCH is a passive extruded heatsink
with thermal and mechanical interfaces. It is attached using a clip with each end hooked through an
anchor soldered to the board. Figure 8 shows the reference thermal solution assembly and
associated components.
Figure 9 and Figure 10 show alternate views of the reference solution. Full mechanical drawings of
the thermal solution assembly and the heatsink clip are provided in Appendix B. Appendix A
contains vendor information for each thermal solution component.
Figure 8. Reference Thermal Solution Assembly
FC-BGA
Mechanical
Interface
Material
Clip
Solder-Down Anchor
Thermal
Interface
Material
Heatsink
ref_therm_solution_assy