Hub Datasheet
Intel
®
E7505 Chipset MCH Datasheet 3
Contents
1 Introduction ................................................................................................................15
1.1 Terminology.........................................................................................................15
1.2 Reference Documents.........................................................................................16
1.3 Intel
®
E7505 Chipset System Architecture..........................................................18
2 Signal Description ................................................................................................... 21
2.1 Host Interface Signals .........................................................................................23
2.2 DDR Channel A Signals ......................................................................................26
2.3 DDR Channel B Signals ......................................................................................29
2.4 Hub Interface_A Signals......................................................................................32
2.5 Hub Interface_B Signals......................................................................................32
2.6 AGP Interface Signals .........................................................................................33
2.6.1 AGP Arbitration Signals..........................................................................33
2.6.2 AGP Address / Data Signals ..................................................................34
2.6.3 AGP Command/Control Signals.............................................................35
2.7 Clocks, Reset, and Miscellaneous Signals..........................................................37
2.8 Strap Signals .......................................................................................................38
3 Register Description ...............................................................................................39
3.1 Register Nomenclature and Access Attributes....................................................39
3.2 PCI Configuration Space Access ........................................................................40
3.2.1 PCI Bus Configuration Mechanism ........................................................41
3.3 General Routing Configuration Accesses ...........................................................41
3.3.1 Logical PCI Bus #0 Configuration Mechanism .......................................42
3.3.2 Primary PCI Downstream Configuration Mechanism .............................42
3.3.3 HI_B Bus Configuration Mechanism ......................................................42
3.3.4 AGP Bus Configuration Mechanism.......................................................43
3.4 I/O Mapped Registers .........................................................................................43
3.4.1 CONFIG_ADDRESS—Configuration Address Register ........................44
3.4.2 CONFIG_DATA—Configuration Data Register......................................44
3.5 Chipset Host Controller Registers (Device 0, Function 0)...................................45
3.5.1 VID—Vendor Identification Register (D0:F0) .........................................46
3.5.2 DID—Device Identification Register (D0:F0)..........................................46
3.5.3 PCICMD—PCI Command Register (D0:F0) ..........................................47
3.5.4 PCISTS—PCI Status Register (D0:F0) ..................................................48
3.5.5 RID—Revision Identification Register (D0:F0) .......................................49
3.5.6 SUBC—Sub-Class Code Register (D0:F0) ............................................49
3.5.7 BCC—Base Class Code Register (D0:F0).............................................49
3.5.8 MLT—Master Latency Timer Register (D0:F0) ......................................50
3.5.9 HDR—Header Type Register (D0:F0)....................................................50
3.5.10 APBASE—Aperture Base Configuration Register (D0:F0) ....................51
3.5.11 SVID—Subsystem Vendor Identification Register (D0:F0) ....................52
3.5.12 SID—Subsystem Identification Register (D0:F0) ...................................52
3.5.13 CAPPTR—Capabilities Pointer Register (D0:F0)................................... 52
3.5.14 CAPID—Product Specific Capability Identifier Register (D0:F0)............53
3.5.15 MCHCFG—MCH Configuration Register (D0:F0) ..................................54