Hub Datasheet

Intel
®
E7505 Chipset MCH Datasheet 205
Ballout and Package Information
NOTES:
1. All dimensions are in millimeters.
2. Substrate thickness and package overall height are thicker than standard 492-L-PBGA
3. Primary datum —C— and seating plane are defined by the spherical crowns of the solder balls.
4. All dimensions and tolerances conform to ANSI Y14.5M-1982.
Figure 7-5. Package Dimensions (Top and Side Views)
1.10 ± 0.10 mm
Die
Substrate
0.60 ± 0.10 mm
Seating Plane
1.940 ± 0.150 mm
0.20 –C–
See note 3.