Guide

Thermal Specifications
R
Intel
®
E7500/E7501/E7505 Chipset MCH Thermal Design Guide 15
4 Thermal Specifications
4.1 Case Temperature and Thermal Design Power
For TDP specifications, see Table 1 for the E7500 chipset MCH, Table 2 for the E7501 chipset
MCH, and Table 3 for the E7505 chipset MCH. FC-BGA packages have poor heat transfer
capability into the board and have minimal thermal capability without thermal solutions. Intel
recommends that system designers plan for one or more heatsinks when using the
E7500/E7501/E7505 chipset.
4.2 Die Temperature
To ensure proper operation and reliability of the MCH, the die temperatures must be at or below
the values specified in Table 1, Table 2, and Table 3. System and/or component level thermal
solutions are required to maintain die temperatures below the maximum temperature specification.
Refer to Chapter 5 for guidelines on accurately measuring package die temperatures.
Table 1. Intel
®
E7500 Chipset MCH Thermal Specifications
Parameter Maximum
T
case
102 °C
TDP
dual channel
7.5 W
Table 2. Intel
®
E7501 Chipset MCH Thermal Specifications
Parameter Maximum
T
case
105 °C
TDP
dual channel
8.5 W
TDP
single channel
7.8 W
Table 3. Intel
®
E7505 Chipset MCH Thermal Specifications
Parameter Maximum
T
case
105 °C
TDP
dual channel
6.5 W
TDP
single channel
5.1 W