Guidelines

Thermal Metrology
R
18 Intel
®
E7500 MCH Thermal and Mechanical Design Guidelines
Figure 4. 90° Angle Attach Methodology
90° Angle Attach
3.3 mm (0.13 in.)
Diameter Hole
Thermocouple Bead
Die
Substrate
Heatsink
Thermocouple Wire
NOTE: Not to scale.
5.1.2 0° Angle Attach Methodology
1. Mill a 3.3 mm (0.13 in.) diameter hole centered on bottom of the heatsink base. The milled
hole should be approximately 1.5 mm (0.06 in.) deep.
2. Mill a 1.3 mm (0.05 in.) wide slot, 0.5 mm (0.02 in.) deep, from the centered hole to one edge
of the heatsink. The slot should be in the direction parallel to the heatsink fins (see Figure 6).
3. Attach thermal interface material (TIM) to the bottom of the heatsink base.
4. Cut out portions of the TIM to make room for the thermocouple wire and bead. The cutouts
should match the slot and hole milled into the heatsink base.
5. Attach a 36 gauge or smaller calibrated K-type thermocouple bead or junction to the center of
the top surface of the die using high thermal conductivity cement. During this step, make sure
no contact is present between the thermocouple cement and the heatsink base because any
contact will affect the thermocouple reading. It is critical that the thermocouple bead
makes contact with the die (see Figure 5).
6. Attach heatsink assembly to the MCH, and route thermocouple wires out through the milled
slot.