Guidelines

Thermal Specifications
R
Intel
®
E7500 MCH Thermal and Mechanical Design Guidelines 15
4 Thermal Specifications
4.1 Power
See Table 1 for TDP specifications for the E7500 MCH. FC-BGA packages have poor heat
transfer capability into the board and have minimal thermal capability without thermal solutions.
Intel recommends that system designers plan for one or more heatsinks when using the E7500
chipset.
4.2 Die Temperature
To ensure proper operation and reliability of the MCH, the die temperatures must be at or below
the values specified for the MCH in Table 1. System or component level thermal solutions are
required to maintain die temperatures below the maximum temperature specifications. Refer to
Chapter 5 for guidelines on accurately measuring package die temperatures.
Table 1. Intel
®
E7500 MCH Thermal Specifications
Parameter Maximum
T
die-hs
102 °C
TDP 9.0 W
NOTE: T
die-hs
is defined as the maximum die temperature with the reference thermal solution attached.