Guidelines

Thermal Mechanical Design
30 Dual-Core Intel
®
Xeon
®
Processor 7000 Sequence Thermal /Mechanical Guidelines
If other custom heatsinks are intended for use with the Dual-Core Intel Xeon processor 7000
sequence, they must support the following interface control requirements to be compatible with the
reference mechanical components:
• Requirement 1: Heatsink assembly must stay within the volumetric keep-in.
• Requirement 2: Maximum mass and center of gravity.
Current maximum heatsink mass is 1000 grams [2.2 lbs] and the maximum center of gravity
38.1 mm [1.5 in.] above the bottom of the heatsink base.
• Requirement 3: Maximum and minimum compressive load.
Any custom thermal solution design should meet the loading specification as documented within
this document, and should refer to the Datasheet for specific details on package loading
specifications.
Figure 2-11. 2U+ CEK Heatsink Thermal Performance
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
0 10 20 30 40 50 60 70 80 90 100
CFM Through Fins
0.00
0.10
0.20
0.30
0.40
0.50
0.60
0.70
0.80
Mean Test 
ca
= 0.1435 + 1.2225*CFM
-0.9397
 = 0.0024 C/W, non-uniform heat

P Test = 5.52e-05CFM
2
+ 5.24e-03CFM