Guidelines

Intel
®
7500 Chipset Thermal Mechanical Design Guide 13
Packaging Technology
2.2 Package Mechanical Requirements
The Intel 7500 chipset package has a bare die that is capable of sustaining a maximum
static normal load of 15 lbf (67N). These mechanical load limits must not be exceeded
during heatsink installation, mechanical stress testing, standard shipping conditions,
and/or any other use condition.
Note: The heatsink attach solutions must not induce continuous stress to the IOH package
with the exception of a uniform load to maintain the heatsink-to-package thermal
interface.
Note: These specifications apply to uniform compressive loading in a direction perpendicular
to the die top surface.
Note: These specifications are based on limited testing for design characterization. Loading
limits are for the package only.
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Table 2-2. Pre-Load Requirements
Load Value
Maximum Static Normal Load 15 lbf
Minimum Preload for thermals 8.7 lbf
Ergonomic Limit 15 lbf