Guide

Components Assembly Instructions
64 Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family
Thermal/ Mechanical Specifications and Design Guide
Note: The processor thermal mechanical solution assembly begins with surface mounting the
LGA2011-1 socket onto the baseboard. The remaining steps presumed that the
socket(s) have already been surface-mounted onto the board. Intel provides detailed
instruction for lead free manufacturing of complex interconnects on the Intel Learning
Network (www.learn.intel.com). For more detailed installation instructions as well as
recommendations on board manufacturing, please download the Intel® Xeon® E7-
2800/4800/8800 v2 product family-based Platform Manufacturing Advantage Service.
A.2 ILM Installation
•Backplate
The standoff pattern on the back plate also acts as a key-in feature. Align the back
plate standoff pattern to the secondary side of baseboard’s hole pattern before mating
the back plate to the baseboard. While installing the back plate or placing the
motherboard on the back plate, care should be taken to visually align them to prevent
damaging the motherboard. Insert the back plate fasteners through the holes and hold
the back plate against the board ensuring that all 4 studs have protruded through the
board holes.
Figure A-1. Processor and Enabling Components Mechanical Assembly
Processor Heatsink
Processor and ILM
in CLOSED Position
ILM Back Plate