Guide

Components Assembly Instructions
Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family 63
Thermal/ Mechanical Specifications and Design Guide
A Components Assembly
Instructions
Reference Enabling components are designed for compatibility with the Intel Xeon
processor E7-800/4800/8800 v2 product family and to ease board and system
assembly. The processor enabling solution is illustrated in Figure A-1. Processor and its
thermal/mechanical solution is installed onto a motherboard at the board or system
assembly site. Assembly instructions described in this section assumes board and
system assembly site maintain an controlled manufacturing environment. That is tools
and processes are well controlled and maintained in achieve compliance with the
processor and components specifications. Field upgrade and replacement is outside the
scope of this section as it depends on system and board design.
The processor and its enabling components assembly are divided into three areas. First
is the ILM installation onto the motherboard. The second is the processor installation,
and last is the processor heatsink installation and securing it to the ILM.
Instructions provided hereon are an overview of the components assembly and
installation onto a board or a system and are subject to change. For additional details,
see the components assembly instructional guide which can be obtain by contacting
your Intel field engineer.
A.1 Processor Enabling Components
Processor enabling components consist of a set of components that enable integration
of the processor with the board and system. Processor enabling components are listed
in Table A-1 and are illustrated in Figure A-1.
Table A-1. Processor Enabling Components
Item Description Notes
1 Motherboard Customer board with LGA2011-1 socket attached
2ILM Back Plate
Assembled at the supplier to include: Insulator, and
standoffs (4x)
3ILM
Assembled at the supplier to include: Insulator and
cover and the captive hardware
4 Processor
5 Processor Heatsink
Processor Heatsink assembly includes: heatsink base
with fins and the captive hardware and pre-applied
thermal interface material