Guide

Thermal and Mechanical Design
50 Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family
Thermal/ Mechanical Specifications and Design Guide
• May increase frequency benefit from Intel Turbo Boost Technology.
• Will increase acoustics
• May result in lower wall power
Customers must characterize a T
control_offset
value for their system to meet frequency,
acoustics, and wall power goals. T
control_offset
is programmable for the follow-on
processor in this platform.
2.3.4 Thermal Excursion Power
Under fan failure or other anomalous thermal excursions, processor temperature (T
CASE
or DTS) may exceed the thermal profile for a duration totaling less than 360 hours per
year without affecting long term reliability (life) of the processor. For more typical
thermal excursions, Thermal Monitor is expected to control the processor power level
as long as conditions do not allow the T
CASE
to exceed the temperature at which
Thermal Control Circuit (TCC) activation initially occurred.
Under more severe anomalous thermal excursions when the processor temperature
cannot be controlled at or below thermal profile by TCC activation, then data integrity is
not assured. At some higher thresholds, THERMTRIP# will enable a shut down in an
attempt to prevent permanent damage to the processor.
Compliance to anomalous thermal excursion can be evaluated by ensuring the
processor T
CASE
value does not exceed T
CASE_MAX
at the anomalous power level for the
environmental condition of interest, such as fan failure. This anomalous power level is
equal to 75% of the TDP limit.
2.3.5 System Thermal Environmental Conditions
2.3.5.1 Ambient Temperature
The temperature of the inlet air entering the processor is referenced in this document
as the ambient temperature (T
LA
). This is not a system requirement. It is measured
from the air upstream and in close vicinity to the processor cooling device. For the
cooling systems, the ambient temperature is measured from the inlet air to the cooling
device.
2.3.5.2 Airflow
Airflow should be provided by a system fan or blower in order to cool the processor
package. See the recommended airflow rate in Table 2-15.
2.3.5.3 Pressure Drop
The value identified Table 2-15 is the allowable pressure drop in the airflow to ensure
cooling requirements for the system components at downstream from the processor
are met while achieving processor cooling requirements.