Guide

3 Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family
Thermal/ Mechanical Specifications and Design Guide,
Contents
1Introduction..............................................................................................................9
1.1 Objective ...........................................................................................................9
1.2 Scope................................................................................................................9
1.3 References.......................................................................................................11
1.4 Terminology .....................................................................................................12
2 Thermal and Mechanical Design...............................................................................13
2.1 Mechanical Requirements ...................................................................................13
2.1.1 Processor Package Mechanical Specifications..............................................13
2.1.2 LGA2011-1 Socket Mechanical Specifications..............................................17
2.1.3 Mechanical Considerations.......................................................................28
2.1.4 Mechanical Load Specifications.................................................................29
2.1.5 Independent Loading Mechanism (ILM) .....................................................30
2.1.6 Heatsink Mechanical Requirements ...........................................................39
2.2 Thermal Specifications.......................................................................................39
2.2.1 Thermal Management .............................................................................40
2.2.2 TCASE and DTS Based Thermal Specifications............................................41
2.2.3 Thermal Metrology .................................................................................42
2.2.4 Processor Thermal Solution Performance Targets........................................45
2.2.5 Socket Maximum Temperature.................................................................46
2.2.6 Thermal Interface Material (TIM)..............................................................47
2.3 Thermal Design Guidelines .................................................................................47
2.3.1 Intel® Turbo Boost Technology................................................................47
2.3.2 Fan Speed Control..................................................................................48
2.3.3 Tcontrol Relief .......................................................................................49
2.3.4 Thermal Excursion Power ........................................................................50
2.3.5 System Thermal Environmental Conditions ................................................50
2.3.6 Thermal Solution Performance Characterization..........................................51
2.4 Design Considerations........................................................................................52
2.4.1 System Design Considerations .................................................................52
2.4.2 Heatsink Design Consideration .................................................................53
2.4.3 Thermal Interface Material (TIM) Considerations.........................................54
2.4.4 Mechanical Design Considerations.............................................................54
2.4.5 PCB Design Consideration........................................................................55
2.5 Reference Thermal Solution................................................................................59
2.5.1 Processor Heatsink Design Boundary Conditions.........................................59
2.5.2 Tower Heatsink Design............................................................................59
2.5.3 Tower Heatsink Performance....................................................................60
A Components Assembly Instructions.........................................................................63
A.1 Processor Enabling Components..........................................................................63
A.2 ILM Installation.................................................................................................64
A.3 Processor Installation.........................................................................................66
A.4 Heatsink Installation..........................................................................................67
B Quality and Reliability Requirements.......................................................................69
B.1 Thermal/Mechanical Solution Stress Test..............................................................69
B.1.1 Customer Environmental Reliability Testing................................................70
B.1.2 Socket Durability Test.............................................................................70
B.2 Ecological Requirement......................................................................................70
CSupplier Listing.......................................................................................................73
C.1 Intel Enabled Supplier Information ......................................................................73
D Processor Package Mechanical Drawings.................................................................77