Intel Xeon Processor 2.80 GHz Thermal/Mechanical Design Guidelines

Dual-Core Intel® Xeon® Processor 2.80 GHz Thermal/Mechanical Design Guidelines 3
Contents
1 Introduction.........................................................................................................................7
1.1 Objective ...............................................................................................................7
1.2 Scope ....................................................................................................................7
1.3 References............................................................................................................7
1.4 Definition of Terms ................................................................................................8
2 Thermal/Mechanical Reference Design ...........................................................................11
2.1 Mechanical Requirements...................................................................................11
2.1.1 Processor Mechanical Parameters ........................................................11
2.1.2 Dual-Core Intel® Xeon® Processor 2.80 GHz Package ........................12
2.1.3 Dual-Core Intel Xeon Processor 2.80 GHz Considerations ...................14
2.2 Thermal Requirements........................................................................................15
2.2.1 Thermal Profile.......................................................................................15
2.2.2 TCONTROL Definition............................................................................16
2.2.3 Dual Thermal Profile Concept for the
Dual-Core Intel Xeon Processor 2.80 GHz ............................................18
2.2.4 Performance Targets..............................................................................19
2.2.5 Altitude ...................................................................................................20
2.3 Characterizing Cooling Solution Performance Requirements.............................20
2.3.1 Fan Speed Control .................................................................................20
2.3.2 Processor Thermal Characterization Parameter Relationships .............21
2.3.3 Chassis Thermal Design Considerations ...............................................24
2.4 Thermal/Mechanical Reference Design Considerations .....................................24
2.4.1 Heatsink Solutions..................................................................................24
2.4.2 Thermal Interface Material .....................................................................25
2.4.3 Summary................................................................................................26
2.4.4 Assembly Overview of the Intel Reference Thermal
Mechanical Design .................................................................................26
2.4.5 Thermal Solution Performance Characteristics......................................28
2.4.6 Thermal Profile Adherence.....................................................................30
2.4.7 Components Overview ...........................................................................32
2.4.8 Boxed Active Thermal Solution for the
Dual-Core Intel Xeon Processor 2.80 GHz ............................................36
A Mechanical Drawings .......................................................................................................39
B Dual-Core Intel® Xeon® Processor 2.80 GHz Safety Requirements ..............................57
C Quality and Reliability Requirements ...............................................................................59
C.1 Intel Verification Criteria for the Reference Designs ...........................................59
C.1.1 Reference Heatsink Thermal Verification...............................................59
C.1.2 Environmental Reliability Testing ...........................................................59
C.1.3 Material and Recycling Requirements....................................................61
D Supplier Information .........................................................................................................63
D.1 Intel Enabled Suppliers .......................................................................................63