64-bit Intel Xeon Processorwith 1MB L2 Cache Thermal/Mechanical Design Guidelines

Thermal/Mechanical Reference Design
R
22 64-bit Intel
®
Xeon™ Processor MP with 1 MB L2 Cache
Thermal/Mechanical Design Guidelines
Figure 2-9. 2U+ Cooling Solution Heatsink Thermal Performance
0.15
0.20
0.25
0.30
0.35
0.40
0.45
0.50
0.55
0 102030405060708090100
CFM Through Fins
Ψ
ca
, C/W
0.00
0.10
0.20
0.30
0.40
0.50
0.60
0.70
0.80
∆
P, inch water
Mean Test
Ψ
ca
= 0.2199 + 1.4415*CFM
-1.0496
σ
= 0.0086 C/W, non-uniform heat
∆P Test = 5.47e-05CFM
2
+ 5.26e-03CFM
If other custom heatsinks are intended for use with the 64-bit Intel Xeon processor MP with 1 MB
L2 cache, they must support the following interface control requirements to be compatible with the
reference mechanical components:
• Requirement 1: Heatsink assembly must stay within the volumetric keep-in.
• Requirement 2: Maximum mass and center of gravity:
Current maximum heatsink mass is 1000 grams [2.2 lbs] and the maximum center of gravity 3.81
cm [1.5 in.] above the bottom of the heatsink base.
• Requirement 3: Maximum and minimum compressive load:
Any custom thermal solution design should meet the loading specification as documented within
this document, and should refer to the datasheet for specific details on package loading
specifications.
2.4.6 Structural Considerations of Cooling Solution
As Intel explores methods of keeping thermal solutions within the air-cooling space, the mass of the
thermal solutions is increasing. Due to the flexible nature (and associated large deformation) of
baseboard-only attachments, Intel reference solutions, such as cooling solution, are now commonly
using direct chassis attach (DCA) as the mechanical retention design. The mass of the new thermal
solutions is large enough to require consideration for structural support and stiffening on the chassis.
Intel has published a best know method (BKM) document that provides specific structural guidance
for designing DCA thermal solutions. The document is titled Chassis Strength and Stiffness
Measurement and Improvement Guidelines for Direct Chassis Attach Solutions.