Intel Xeon Processor with 800 MHz System Bus Thermal/Mechanical Design Guide

Intel® Xeon™ Processor with 800 MHz System Bus Thermal/Mechanical Design Guidelines 9
Introduction
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TDP
Thermal Design Power should be used for processor/chipset thermal solution design
targets. TDP is not the maximum power that the processor/chipset can dissipate.
Thermal Monitor
A feature on the processor that can keep the processor’s die temperature within factory
specifications under nearly all conditions.
Thermal Profile Line that defines case temperature specification of a processor at a given power level.
TIM
Thermal Interface Material: The thermally conductive compound between the heatsink
and the processor case. This material fills the air gaps and voids, and enhances the
transfer of the heat from the processor case to the heatsink.
T
LA
The measured ambient temperature locally surrounding the processor. The ambient
temperature should be measured just upstream of a passive heatsink or at the fan inlet
for an active heatsink.
T
SA
The system ambient air temperature external to a system chassis. This temperature is
usually measured at the chassis air inlets.
U
A unit of measure used to define server rack spacing height. 1U is equal to 1.75 in, 2U
equals 3.50 in, etc.
Table 1-2. Terms and Descriptions (Cont’d)
Term Description