Intel Xeon Processor with 800 MHz System Bus Thermal/Mechanical Design Guide

Intel® Xeon™ Processor with 800 MHz System Bus Thermal/Mechanical Design Guidelines 19
Thermal/Mechanical Reference Design
B does not impose any additional risk to Intel’s long-term reliability requirements. Thermal
solutions that exceed Thermal Profile B specification are considered incompliant and will
adversely affect the long-term reliability of the processor.
Refer to the Intel Xeon Processor with 800 MHz System Bus or Chapter 2.2.4 for the Thermal
Profile A and Thermal Profile B specifications. Chapter 2.4 of this document also provides details
on the 2U+ and 1U Intel reference thermal solutions that are designed to meet the Intel Xeon
Processor with 800 MHz System Bus Thermal Profile A and Thermal Profile B respectively.
2.2.4 Performance Targets
The Thermal Profile specifications for this processor are published in the Intel® Xeon™ Processor
with 800 MHz System Bus at 2.80 GHz and 3.60 GHz Datasheet. These Thermal Profile
specifications are to be used as a reference in the subsequent discussions.
The thermal specifications shown in this graph are for reference only. Refer to the Intel® Xeon™
Processor with 800 MHz System Bus at 2.80 GHz and 3.60 GHz Datasheet for the Thermal Profile
specifications. In case of conflict, the data information in the EMTS supersedes any data in this
figure.
Table 2-6 describes thermal performance targets for the processor cooling solution enabled by
Intel..
2.2.5 Altitude
The reference heatsink solutions will be evaluated at sea level (0 meters). The system designers
who need to account for altitude effects in the overall system thermal design must make sure that
either Thermal Profile A or B specification for the processor is met at the targeted altitude.
2.3 Characterizing Cooling Solution Performance
Requirements
2.3.1 Fan Speed Control
Fan speed control (FSC) techniques to reduce system level acoustic noise are a common practice in
server designs. The fan speed is one of the parameters that determine the amount of airflow
provided to the thermal solution. Additionally, airflow is proportional to a thermal solution’s
performance, which consequently determines the T
CASE
of the processor at a given power level.
Since the T
CASE
of a processor is an important parameter in the long-term reliability of a processor,
the FSC implemented in a system directly correlates to the processor’s ability to meet the Thermal
Table 2-6. Intel Reference Heatsink Performance Targets for the
Intel® Xeon™ Processor with 800 MHz System Bus
Thermal
Solution Type
Target Thermal
Profile
T
LA
Assumption
(°C)
TDP (W)
Thermal Performance Target,
Ψca
(Mean + 3σ)(°C/W)
2U+ Form Factor Thermal Profile A 40°C 103 305
1U Form Factor Thermal Profile B 40°C 103 0.384