Intel Xeon Processor 2.80 GHz Thermal/Mechanical Design Guidelines

Thermal/Mechanical Reference Design
38 Dual-Core Intel
®
Xeon
®
Processor 2.80 GHz Thermal/Mechanical Design Guidelines
2.4.8.2 Systems Considerations Associated with the Active CEK
This heatsink was designed to help pedestal chassis users to meet the thermal processor
requirements without the use of chassis ducting. It may be necessary to implement some form of
chassis air guide or air duct to meet the T
LA
temperature of 40 °C depending on the pedestal
chassis layout. Also, while the active heatsink solution is designed to mechanically fit into a 2U
chassis, it may require additional space at the top of the heatsink to allow sufficient airflow into the
heatsink fan. Therefore, additional design criteria may need to be considered if this heatsink is used
in a 2U rack mount chassis, or in a chassis that has drive bay obstructions above the inlet to the fan
heatsink.
Thermal Profile A should be used to help determine the thermal performance of the platform. The
active fan utilizes PWM fan speed control technology to automatically adjust fan RPM conforming
to the correct thermal load line. It is critical to supply a constant +12 V to the fan header so that the
active CEK heat sink solution can operate properly. If a system board has a jumper setting to select
either a constant +12 V power to the fan header or a variable voltage, it is strongly recommended
that the jumper be set by default to the constant +12 V setting.
It is recommended that the ambient air temperature outside of the chassis be kept at or below
35 °C. The air passing directly over the processor heatsink should not be preheated by other system
components. Meeting the processor’s temperature specification is the responsibility of the system
integrator.
2.4.8.3 Boxed Processor Contents
A direct chassis attach method must be used to avoid problems related to shock and vibration, due
to the weight of the heatsink required to cool the processor. The board must not bend beyond
specification in order to avoid damage. The boxed processor contains the components necessary to
solve both issues. The boxed processor will include the following items:
• Dual-Core Intel Xeon processor 2.80 GHz
• Unattached (Active or Passive) Heatsink
• 4 screws, 4 springs, and 4 heatsink standoffs (all captive to the heatsink)
• Thermal Interface Material (TIM)
• Certificate of Authenticity (COA) and Manual
• Intel Inside® Logo
The other items listed in Figure 2-8 that are required to complete this solution will be shipped with
either the chassis or boards. They are as follows:
• CEK Spring (supplied by baseboard vendors)
• Chassis standoffs (supplied by chassis vendors)
§
Table 2-7. Fan Cable Connector Pin Out (Active CEK)
Pin Number Signal Color
1 Ground (Constant) Black
2 Power (+12V) Yellow
3 Signal: 2 pulses per revolution Green
4 Control Blue