Intel Xeon Processor with 800 MHz System Bus Thermal/Mechanical Design Guide

12 Intel® Xeon™ Processor with 800 MHz System Bus Thermal/Mechanical Design Guidelines
Thermal/Mechanical Reference Design
7. Experimentally validated test condition used a heatsink mass of 1 lbm (~0.45 kg) with 100 G
acceleration measured at heatsink mass. The dynamic portion of this specification in the
product application can have flexibility in specific values, but the ultimate product of mass
times acceleration should not exceed this validated dynamic load (1 lbm x 100 G = 100 lb).
Allowable strain in the dynamic compressive load specification is in addition to the strain
allowed in static loading.
8. Transient loading is defined as a 2-second duration peak load superimposed on the static load
requirement, representative of loads experienced by the package during heatsink installation.
2.1.2 Intel® Xeon™ Processor with 800 MHz System Bus
Package
The Intel Xeon Processor with 800 MHz System Bus is packaged using the flip-chip micro pin grid
array 4 (FC-mPGA4) package technology. Please refer to the IIntel® Xeon™ Processor with 800
MHz System Bus at 2.80 GHz and 3.60 GHz Datasheet for detailed mechanical specifications. The
Intel Xeon Processor with 800 MHz System Bus mechanical drawing, Figure 2-1, provides the
mechanical information for the Intel Xeon Processor with 800 MHz System Bus. The stackup
height of the processor in the socket is shown in Appendix A. The drawing is superseded by the
drawing in the processor datasheet, should there be any conflict.