Intel Xeon Processor with 800 MHz System Bus Thermal/Mechanical Design Guide

Intel® Xeon™ Processor with 800 MHz System Bus Thermal/Mechanical Design Guidelines 5
A-12 Baseboard Keepout Footprint Definition and Height Restrictions for
Enabling Components (sheet 5 of 6)...................................................................51
A-13 Baseboard Keepout Footprint Definition and Height Restrictions for
Enabling Components (sheet 6 of 6)...................................................................52
A-14 1U CEK Heatsink (Sheet 1 of 4)..........................................................................53
A-15 1U CEK Heatsink (Sheet 2 of 4)..........................................................................54
A-16 1U CEK Heatsink (Sheet 3 of 4)..........................................................................55
A-17 1U CEK Heatsink (Sheet 4 of 4)..........................................................................56
A-18 4-Pin Fan Cable Connector (for active CEK Heatsink) .......................................57
A-19 4-Pin Baseboard for Header (for active CEK Heatsink) ......................................58
B-20 0× Attachment Method ........................................................................................61
B-21 0× Processor Case Temperature Measurement Location ..................................61
B-22 Local Air Thermocouple Placement for Passive Heatsinks.................................62
B-23 Local Air Thermocouple Placement for Active Heatsinks (Side View) ................62
B-24 Local Air Thermocouple Placement for Passive Heatsinks.................................63
D-25 Random Vibration PSD .......................................................................................68
D-26 Shock Acceleration Curve...................................................................................68
F-27 Thermal Sensor Circuit........................................................................................74
F-28 Concept for Clocks under Thermal Monitor Control............................................75
F-29 Thermal Monitor 2 Frequency and Voltage Ordering..........................................76
F-30 On-Die Thermal Diode Sensor Time Delay.........................................................78
Tables
1-1 Reference Documents...........................................................................................7
1-2 Terms and Descriptions ........................................................................................8
2-3 Processor Mechanical Parameters Table ...........................................................11
2-6 Intel Reference Heatsink Performance Targets for the
Intel® Xeon™ Processor with 800 MHz System Bus19
2-7 Fan Speed Control, TCONTROL and TDIODE Relationship..............................20
2-15 CEK Heatsink Thermal Mechanical Characteristics............................................32
2-16 Recommended Thermal Grease Dispense Weight.............................................32
2-17 PWM Fan Frequency Specifications (4-Pin Active CEK Heatsink) .....................35
2-18 Fan Specifications (3-pin & 4-pin Active CEK Heatsink).....................................35
2-19 Fan Cable Connector Pin Out (3-Pin Active CEK Heatsink) ............................... 36
2-20 Fan Cable Connector Pin Out (4-Pin Active CEK Heatsink) ............................... 36
2-21 Fan Cable Connector Supplier & Part Number ................................................... 37
A-1 Mechanical Drawing List .....................................................................................39
B-2 Intel® Xeon™ Processor with 800 MHz System Bus Thermal
Characterization Parameter CorrectionOffset for TTV ........................................59
E-3 Enabled Suppliers ...............................................................................................71