Intel Xeon Processor with 800 MHz System Bus Thermal/Mechanical Design Guide

Intel® Xeon™ Processor with 800 MHz System Bus Thermal/Mechanical Design Guidelines 11
2 Thermal/Mechanical Reference
Design
2.1 Mechanical Requirements
The mechanical performance of the processor cooling solution must satisfy the requirements
described in this section.
2.1.1 Processor Mechanical Parameters
Note: In the case of a discrepancy, the most recent Intel Xeon Processor with 800 MHz System Bus
supersedes targets listed in the above table.
1. These specifications apply to uniform compressive loading in a direction perpendicular to the
IHS top surface.
2. This is the minimum and maximum static force that can be applied by the heatsink and
retention solution to maintain the heatsink and processor interface.
3. These parameters are based on limited testing for design characterization. Loading limits are
for the package only and do not include the limits of the processor socket.
4. This specification applies for thermal retention solutions that allow baseboard deflection.
5. This specification applies for thermal retention solutions that prevent baseboard deflection.
6. Dynamic loading is defined as an 11 ms duration average load superimposed on the static load
requirement.
Table 2-3. Processor Mechanical Parameters Table
Parameter Minimum Maximum Unit Notes
Volumetric Requirements and
Keepouts
Refer to drawings
in Appendix A
Heatsink Mass
1000
2.2
g
lbs
Static Compressive Load
44
10
222
50
N
lbf
1,2,3,4
44
10
288
65
N
lbf
1,2,3,5
Dynamic Compressive Load
N/A
NA
222 N + 0.45 kg * 100 G
50 lbf (static) + 1 lbm * 100 G
N
lbf
1,3,4,6,7
N/A
NA
288 N + 0.45 kg * 100 G
65 lbf (static) + 1 lbm * 100 G
N
lbf
1,3,5,6,7
Transient N/A
445
100
N
lbf
1,3,8