Intel Xeon processor LV Thermal Design Guide
Introduction
Dual-Core Intel
®
Xeon
®
processor LV and ULV
Thermal Design Guide August 2006
8 Reference Number: 311374-002
1.3 Reference Documents
The reader of this specification should also be familiar with material and concepts
presented in the following documents:
•Intel
®
Mobile Processor Micro-FCPGA Socket (mPGA479M) Design Guidelines
•Dual-Core Intel
®
Xeon
®
processor LV and ULV Datasheet
Note: Unless otherwise noted, these documents are available through your Intel field sales
representative.
1.4 Thermal Model Availability
Intel provides thermal simulation models of the device and a thermal model user’s
guide to aid designers in simulating, analyzing, and optimizing thermal solutions in an
integrated, system-level environment. The models are for use with commercially
available Computational Fluid Dynamics (CFD)-based thermal analysis tools including
Flotherm* (version 3.1 or higher) by Flomerics, Inc. or Icepak* by Fluent, Inc. Contact
your Intel representative to order the thermal models and associated user’s guides.