Intel Xeon processor LV Thermal Design Guide

Dual-Core Intel
®
Xeon
®
processor LV and ULV
August 2006 Thermal Design Guide
311374-002 27
Reference Thermal Solutions
6.4 1U+ Reference Heatsink
The reference thermal solution compatible with the 1U and larger form factor is
designed assuming a maximum ambient temperature (as measured outside the
chassis) of 40 °C with a minimum volumetric airflow rate through the heatsink fins of 5
CFM. Assuming these boundary conditions are met, the reference thermal solutions will
meet the thermal specifications for both the 15 W and 31 W processor.
Furthermore, the 1U reference heatsink is suitable for dual processor configurations.
Section 6.7 provides further guidance to optimize the component placement to enable
the dual processor configuration.
6.4.1 Mechanical Design
The 1U reference thermal solution is shown in Figure 16. The maximum heatsink height
is constrained to 27 mm. The heatsink uses the fastener assembly (refer to
Section 6.2) to mount to the PCB. Detailed drawings of this heatsink are provided in
Appendix B, “Mechanical Drawings”.
Figure 15. AdvancedTCA* Reference Heatsink Thermal Performance vs. Volumetric
Airflow Rate