64-bit Intel Xeon Processorwith 1MB L2 Cache Thermal/Mechanical Design Guidelines

R
64-bit Intel
®
Xeon™ Processor MP with 1 MB L2 Cache 3
Thermal/Mechanical Design Guidelines
Contents
1 Introduction .......................................................................................................................7
1.1 Objective ................................................................................................................ 7
1.2 Scope .....................................................................................................................7
1.3 References............................................................................................................. 7
1.4 Definition of Terms................................................................................................. 8
2 Thermal/Mechanical Reference Design .......................................................................... 9
2.1 Mechanical Requirements ..................................................................................... 9
2.1.1 Performance Target .................................................................................. 9
2.1.2 Critical Interface Dimensions (CID) ........................................................ 10
2.2 Thermal Requirements ........................................................................................11
2.2.1 Thermal Profile........................................................................................ 11
2.2.2 T
CONTROL
Definition .................................................................................. 13
2.2.3 Performance Targets .............................................................................. 14
2.3 Characterizing Cooling Solution Performance Requirements ............................. 15
2.3.1 Fan Speed Control.................................................................................. 15
2.3.2 Processor Thermal Characterization Parameter Relationships.............. 16
2.3.3 Chassis Thermal Design Considerations................................................ 18
2.4 Thermal/Mechanical Reference Design Considerations .....................................19
2.4.1 Heatsink Solutions .................................................................................. 19
2.4.2 Thermal Interface Material ...................................................................... 19
2.4.3 Summary................................................................................................. 20
2.4.4 Assembly Overview of the Intel Reference Thermal
Mechanical Design.................................................................................. 20
2.4.5 Thermal Solution Performance Characteristics ...................................... 21
2.4.6 Structural Considerations of Cooling Solution ........................................ 22
2.4.7 Components Overview............................................................................ 23
A Mechanical Drawings ..................................................................................................... 27
B Testing Methods.............................................................................................................. 37
B.1 Case Measurement.............................................................................................. 37
B.2 Supporting Test Equipment .................................................................................37
B.3 Thermal Calibration and Controls ........................................................................ 38
B.4 IHS Groove ..........................................................................................................38
B.5 Thermocouple Conditioning and Preparation ...................................................... 39
B.6 Thermocouple Attachment to the IHS.................................................................. 40
B.7 Curing Process..................................................................................................... 43
B.8 Thermocouple Wire Management........................................................................ 43
B.9 Local Air Thermocouple Placement..................................................................... 45
C Safety Requirements ...................................................................................................... 47
D Quality and Reliability Requirements ........................................................................... 49
D.1 Intel Verification Criteria for the Reference Designs............................................ 49
D.1.1 Reference Heatsink Thermal Verification ............................................... 49
D.1.2 Environmental Reliability Testing............................................................ 49
D.1.3 Material and Recycling Requirements .................................................... 51
E Enabled Suppliers Information...................................................................................... 53