603 Pin Socket Design Guidelines

Figure 3-1: Typical Reflow Profile for 63Sn/37Pb solder

3.6.3. Overall Assembly Sequence:

Step 1 - Mount 603 Pin Socket to the motherboard using a surface mount process

Step 2 - Install retention mechanism

Step 3 - Install processor

Step 4 - Install heat sink

3.7. Critical To Function Dimensions:

The 603 Pin Socket shall accept a 603 pin processor pin field. All dimensions are Metric. Asymmetric

features are designed to properly align the socket to the motherboard and prevent the socket from being

assembled incorrectly to the motherboard. The socket dimensions are shown in Figure 9-4 (Appendix

A.4) and Figure 9-5 (Appendix A.5). Figure 9-2 (Appendix A.2) shows the outline of the processor pin

field.

Critical to function dimensions are identified in Table 3-1. Each of the dimensions must meet the

requirements given in Table 3-1. These dimensions will be verified as part of the validation process.

Also, supplier will provide and maintain Critical Process Parameters controlling these CTFs or will

provide direct measurements to meet ongoing quality requirements.

Table 3-1: Socket Critical To Function Dimensions

Dimension Index Minimum mm Maximum mm

Socket Length 63.75

Socket Width 53.70 54

Socket Height (Interposer surface from MB) 5.38 6.15

Assembled Cover Flatness N/A 0.20

Co-planarity

Lead / Surface Mount Feature

N/A

0.15