Intel Xeon Processor with 800 MHz System Bus Thermal/Mechanical Design Guide

4 Intel® Xeon™ Processor with 800 MHz System Bus Thermal/Mechanical Design Guidelines
D.1 Intel Verification Criteria for the Reference Designs ........................................... 67
D.1.1 Reference Heatsink Thermal Verification............................................... 67
D.1.2 Environmental Reliability Testing ........................................................... 67
D.1.3 Material and Recycling Requirements....................................................69
E Enabled Suppliers Information......................................................................................... 71
F Processor Thermal Management Logic and Thermal Monitor Features.......................... 73
F.1 Thermal Management Logic and Thermal Monitor Feature................................73
F.1.1 Processor Power Dissipation .................................................................73
F.1.2 Thermal Monitor Implementation............................................................ 73
F.1.3 Operation and Configuration .................................................................. 75
F.1.4 Thermal Monitor 2 .................................................................................. 75
F.1.5 System Considerations .......................................................................... 76
F.1.6 Operating System and Application Software Considerations................. 77
F.1.7 Legacy Thermal Management Capabilities............................................ 77
F.1.8 Cooling System Failure Warning............................................................ 79
Figures
2-1 Intel® Xeon™ Processor with 800 MHz System Bus Mechanical Drawing ........ 13
2-2 Thermal Profile Diagram .....................................................................................16
2-3 TCONTROL and Thermal Profile Interaction ...................................................... 17
2-4 Dual Thermal Profile Diagram............................................................................. 18
2-5 TCONTROL and Fan Speed Control ..................................................................20
2-6 Processor Thermal Characterization Parameter Relationships .......................... 22
2-7 Exploded View of CEK Thermal Solution Components ...................................... 26
2-8 2U+ CEK Heatsink Thermal Performance .......................................................... 28
2-9 1U CEK Thermal Adherence to Intel® Xeon™ Processor with 800 MHz
System Bus Thermal Profile B ............................................................................ 30
2-10 Isometric View of the 2U+ CEK Heatsink............................................................ 31
2-11 Isometric View of the 1U CEK Heatsink ..............................................................31
2-12 Hat Spring Isometric View................................................................................... 33
2-13 Isometric View of Hat Spring Attachment to the Base Board.............................. 33
2-14 Active CEK Heatsink 3-Pin & 4-Pin (Representation Only)................................. 34
2-15 Fan Cable Connector Pin Out (3-Pin Active CEK Heatsink) ............................... 36
2-16 Fan Cable Connector Pin Out (4-Pin Active CEK Heatsink) ............................... 36
A-1 2U CEK Heatsink (Sheet 1 of 4) ......................................................................... 40
A-2 2U CEK Heatsink (Sheet 2 of 4) ......................................................................... 41
A-3 2U CEK Heatsink (Sheet 3 of 4) ......................................................................... 42
A-4 2U CEK Heatsink (Sheet 4 of 4) ......................................................................... 43
A-5 CEK Hat Spring (Sheet 1 of 3) ............................................................................44
A-6 CEK Hat Spring (Sheet 2of 3) ............................................................................. 45
A-7 CEK Hat Spring (Sheet 3 of 3) ............................................................................46
A-8 Baseboard Keepout Footprint Definition and Height Restrictions for
Enabling Components (sheet 1 of 6)................................................................... 47
A-9 Baseboard Keepout Footprint Definition and Height Restrictions for
Enabling Components (sheet 2 of 6)................................................................... 48
A-10 Baseboard Keepout Footprint Definition and Height Restrictions for
Enabling Components (sheet 3 of 6)................................................................... 49
A-11 Baseboard Keepout Footprint Definition and Height Restrictions for
Enabling Components (sheet 4 of 6)................................................................... 50