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Intel Xeon processor LV Thermal Design Guide

ManualsBrandsIntel ManualsOther64-bit Intel Xeon Processor 2.80D GHz, 1M Cache, 800 MHz FSB
31323334353637383940
Dual-Core Intel
®
Xeon
®
processor LV and ULV
August 2006 Thermal Design Guide
311374-002 33
Reliability Guidelines
8.0 Reliability Guidelines
Each motherboard, heatsink and attach combination may vary the mechanical loading
of the component. The user should carefully evaluate the reliability of the completed
assembly prior to use in high volume. Some general recommendations are shown in
Table 4.
Table 4. Reliability Requirements
Test Requirement Pass/Fail Criteria
Mechanical Shock 50 g, board level, 11 msec, 3 shocks/axis
Visual Check and Electrical
Functional Test
Random Vibration
7.3 g, board level, 45 min/axis, 50 Hz to 2000
Hz
Visual Check and Electrical
Functional Test
Temperature Life
85 °C, 2000 hours total, checkpoints at 168,
500, 1000, and 2000 hours
Visual Check
Thermal Cycling -5 °C to +70 °C, 500 cycles Visual Check
Humidity 85% relative humidity, 55 °C, 1000 hours Visual Check
Notes:
1. The above tests should be performed on a sample size of at least 12 assemblies from three lots of
material.
2. Additional Pass/Fail Criteria may be added at the discretion of the user.