64-bit Intel Xeon Processor with 2MB L2 Cache Thermal/Mechanical Design Guidelines

Introduction
8 64-bit Intel® Xeon™ Processor with 2MB L2 Cache Thermal/Mechanical Design Guidelines
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1.4 Definition of Terms
64-bit Intel
®
Xeon™ Processor with 2MB L2 Cache Thermal Models (in
Flotherm* and Icepak*)
Available electronically
64-bit Intel
®
Xeon™ Processor with 2MB L2 Cache Cooling Solution
Thermal Models (in Flotherm* and Icepak* format)
Available electronically
Thin Electronics Bay Specification (A Server System Infrastructure (SSI)
Specification for Rack Optimized Servers
http://www.ssiforum.com
Table 1-1. Reference DocumentsIntroduction.fm (Sheet 2 of 2)
Table 1-2. Terms and Descriptions (Sheet 1 of 2)
Term Description
Bypass Bypass is the area between a passive heatsink and any object that can act to form a duct.
For this example, it can be expressed as a dimension away from the outside dimension of
the fins to the nearest surface.
FMB Flexible Motherboard Guideline: an estimate of the maximum value of a processor
specification over certain time periods. System designers should meet the FMB values to
ensure their systems are compatible with future processor releases.
FSC Fan Speed Control
IHS Integrated Heat Spreader: a component of the processor package used to enhance the
thermal performance of the package. Component thermal solutions interface with the
processor at the IHS surface.
mPGA604 The surface mount Zero Insertion Force (ZIF) socket designed to accept the 64-bit Intel
Xeon Processor with 2MB L2 Cache.
Offset A value programmed into each processor during manufacturing that can be obtained by
reading the IA_32_TEMPERATURE_TARGET MSR. This is a static and a unique value.
Refer to the IA-32 Intel
®
Architecture Software Developer's Manual Volume 3: System
Programming Guide for further details.
P
MAX
The maximum power dissipated by a semiconductor component.
Ψ
CA
Case-to-ambient thermal characterization parameter (psi). A measure of thermal solution
performance using total package power. Defined as (T
CASE
– T
LA
) / Total Package
Power. Heat source should always be specified for
Ψ measurements.
Ψ
CS
Case-to-sink thermal characterization parameter. A measure of thermal interface material
performance using total package power. Defined as (T
CASE
– T
S
) / Total Package Power.
Ψ
SA
Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal
performance using total package power. Defined as (T
S
– T
LA
) / Total Package Power.
T
CASE
The case temperature of the processor, measured at the geometric center of the topside
of the IHS.
T
CASE
_
MAX
The maximum case temperature as specified in a component specification.
TCC Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature by
using clock modulation when the die temperature is very near its operating limits.
T
CONTROL
A processor unique value, which defines the lower end of the thermal profile and is
targeted to be used in fan speed control mechanisms.
TDP Thermal Design Power: Thermal solution should be designed to dissipate this target
power level. TDP is not the maximum power that the processor/chipset can dissipate.
Thermal Monitor A feature on the processor that can keep the processor’s die temperature within factory
specifications under nearly all conditions.