Computer Hardware User Manual

Intel
®
631xESB/632xESB I/O Controller Hub for Embedded Applications
February 2007 TMDG
3
Contents—Intel
®
6321ESB ICH
Contents
1.0 Introduction..............................................................................................................5
1.1 Design Flow........................................................................................................5
1.2 Definition of Terms..............................................................................................7
1.3 Reference Documents..........................................................................................7
2.0 Packaging Technology ...............................................................................................9
3.0 Thermal Specifications ............................................................................................11
3.1 Thermal Design Power (TDP) ..............................................................................11
3.2 Die Case Temperature .......................................................................................11
4.0 Thermal Simulation ................................................................................................. 12
5.0 Thermal Solution Requirements............................................................................... 13
5.1 Characterizing the Thermal Solution Requirement..................................................13
6.0 Thermal Metrology ..................................................................................................16
6.1 Die Case Temperature Measurements .................................................................. 16
6.1.1 Zero Degree Angle Attach Methodology.....................................................16
7.0 Reference Thermal Solution.....................................................................................19
7.1 Operating Environment ......................................................................................19
7.2 Heatsink Performance........................................................................................19
7.3 Mechanical Design Envelope ...............................................................................20
7.4 Board-Level Components Keepout Dimensions ......................................................21
7.5 Torsional Clip Heatsink Thermal Solution Assembly................................................22
7.5.1 Heatsink Orientation...............................................................................23
7.5.2 Mechanical Interface Material...................................................................24
7.5.3 Thermal Interface Material.......................................................................24
7.5.4 Heatsink Clip ......................................................................................... 25
7.5.5 Clip Retention Anchors............................................................................25
8.0 Reliability Guidelines...............................................................................................26
A Thermal Solution Component Suppliers ................................................................... 27
A.1 Torsional Clip Heatsink Thermal Solution ..............................................................27
B Mechanical Drawings...............................................................................................28
Figures
1 Thermal Design Process..............................................................................................6
2 Intel® 6321ESB I/O Controller Hub Package Dimensions (Top View).................................9
3 Intel® 6321ESB I/O Controller Hub Package Dimensions (Side View)................................9
4 Intel® 6321ESB I/O Controller Hub Package Dimensions (Bottom View).......................... 10
5 Processor Thermal Characterization Parameter Relationships .........................................14
6 Thermal Solution Decision Flowchart...........................................................................17
7 Zero Degree Angle Attach Heatsink Modifications .........................................................17
8 Zero Degree Angle Attach Methodology (Top View).......................................................18
9 Torsional Clip Heatsink Measured Thermal Performance Versus Approach Velocity and Target
at 65C Local-Ambient ...............................................................................................20
10 Torsional Clip Heatsink Volumetric Envelope for the Intel® 6321ESB I/O Controller Hub.... 21
11 Torsional Clip Heatsink Board Component Keepout .......................................................23
12 Torsional Clip Heatsink Assembly ...............................................................................24
13 Torsional Clip Heatsink Assembly Drawing...................................................................29
14 Torsional Clip Heatsink Drawing.................................................................................30