Mobile Intel Pentium 4 Processor with 533 MHz Front Side Bus

Mobile Intel

Pentium

4 Processor with 533 MHz System Bus Datasheet 35

Package Mechanical Specifications

3 Package Mechanical

Specifications

The mobile Intel Pentium 4 processor with 533 MHz FSB is packaged in a 478-pin, FC-PGA2

package. Components of the package include an integrated heat spreader (IHS), processor die, and

the substrate which is the pin carrier. Different views of the package are shown in Figure 7 through

Figure 12. Package dimensions are shown in Table 17.

Note: For Figure 7 through Figure 12, the following notes apply:

1. Unless otherwise specified, the following drawings are dimensioned in millimeters.

2. Figures and drawings labeled as “Reference Dimensions” are provided for informational purposes only.

Reference dimensions are extracted from the mechanical design database and are nominal dimensions with

no tolerance information applied. Reference dimensions are NOT checked as part of the processor

manufacturing process. Unless noted as such, dimensions in parentheses without tolerances are reference

dimensions.

3. Drawings are not to scale.

Note: The drawing below is not to scale and is for reference only. The socket and system board are

supplied as a reference only.

Figure 7. Exploded View of Processor Components on a System Board

stem board

FC-PGA2

31 mm

Heat Spreader

Substrate

35mm square

3.5mm

2.0mm

478 pins

Socket