Mobile Intel Pentium 4 Processor Supporting Hyper-Threading Technology on 90-nm Process Technology

8 Mobile Intel® Pentium® 4 Processor Supporting Hyper-Threading Technology on 90-nm Process Technology Datasheet
Introduction
1.1 Terminology
A # symbol after a signal name refers to an active low signal, indicating a signal is in the active
state when driven to a low level. For example, when RESET# is low, a reset has been requested.
Conversely, when NMI is high, a nonmaskable interrupt has occurred. In the case of signals where
the name does not imply an active state but describes part of a binary sequence (such as address or
data), the # symbol implies that the signal is inverted. For example, D[3:0] = HLHL refers to a hex
A, and D[3:0]# = LHLH also refers to a hex A (H= High logic level, L= Low logic level).
Front side bus (FSB) refers to the interface between the processor and system core logic (the
chipset components). The FSB is a multiprocessing interface to processors, memory, and I/O.
1.1.1 Processor Packaging Terminology
Commonly used terms are explained here for clarification:
• Mobile Intel Pentium 4 processor supporting Hyper-Threading Technology on 90-nm
process technology — Processor in the Micro-FCPGA package with a 1-MB L2 cache.
• Processor — For this document, the term processor is the generic form of the Mobile Intel
Pentium 4 processor supporting Hyper-Threading Technology on 90-nm process technology.
• Keep-out zone — The area on or near the processor that system design can not utilize.
• Intel 852GM/852GME/852PM chipsets — Intel’s Portability chipsets which support DDR
memory technology for the Mobile Intel Pentium 4 processor supporting Hyper-Threading
Technology on 90-nm process technology .
• Processor core — Processor core die with integrated L2 cache.
• FC-mPGA4 package — The Mobile Intel Pentium 4 processor supporting Hyper-Threading
Technology on 90-nm process technology is available in a Flip-Chip Micro Pin Grid Array 4
package, consisting of a processor core mounted on a pinned substrate with an integrated heat
spreader (IHS). This packaging technology employs a 1.27 mm [0.05 in] pitch for the substrate
pins.
• mPGA479 socket — The Mobile Intel Pentium 4 processor supporting Hyper-Threading
Technology on 90-nm process technology mates with the system board through a surface
mount, 479-pin, zero insertion force (ZIF) socket.
• Integrated heat spreader (IHS) —A component of the processor package used to enhance
the thermal performance of the package. Component thermal solutions interface with the
processor at the IHS surface.
• Storage Conditions — refers to a non-operational state. The processor may be installed in a
platform, in a tray, or loose. Processors may be sealed in packaging or exposed to free air.
Under these conditions, processor pins should not be connected to any supply voltages, have
any I/Os biased, or receive any clocks.
Upon exposure to “free air” (i.e., unsealed packaging or a device removed from packaging
material) the processor must handled in accordance with moisture sensitivity labeling (MSL)
as indicated on the packaging material.
• Functional operation — refers to normal operating conditions in which all processor
specifications, including DC, AC, FSB, signal quality, mechanical and thermal, are satisfied.