Mobile Intel Pentium 4 Processor with 533 MHz Front Side Bus

Mobile Intel
®
Pentium
®
4 Processor with 533 MHz System Bus Datasheet 65
Thermal Specifications and Design Considerations
5 Thermal Specifications and
Design Considerations
5.1 Processor Thermal Specifications
The mobile Intel Pentium 4 processor with 533 MHz FSB processor requires a thermal solution to
maintain temperatures within the operating limits as set forth in Section 5.1.1. Any attempt to
operate the processor outside these operating limits may result in permanent damage to the
processor and potentially other components within the system. As processor technology changes,
thermal management becomes increasingly crucial when building computer systems. Maintaining
the proper thermal environment is key to reliable, long-term system operation.
A complete thermal solution includes both component and system level thermal management
features. Component level thermal solutions can include active or passive heatsinks attached to the
processor Integrated Heat Spreader (IHS). Typical system level thermal solutions may consist of
system fans combined with ducting and venting.
For more information on designing a component level thermal solution, refer to the Mobile Intel
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Pentium
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4 Processor Thermal Design Guidelines for Transportable Systems.
5.1.1 Thermal Specifications
To allow for the optimal operation and long-term reliability of Intel processor-based systems, the
system/processor thermal solution should be designed such that the processor remains between the
minimum and maximum case temperature (TC) specifications when operating at or below the
corresponding Thermal Design Power (TDP) value listed per frequency in Table 24 . Thermal
solutions not designed to provide this level of thermal capability may affect the long-term
reliability of the processor and system. For more details on thermal solution design, please refer to
the appropriate processor thermal design guidelines.
The case temperature is defined at the geometric top center of the processor IHS. Analysis
indicates that real applications are unlikely to cause the processor to consume maximum power
dissipation for sustained periods of time. Intel recommends that complete thermal solution designs
target the TDP indicated in Table 24 instead of the maximum processor power consumption. The
Intel
®
Thermal Monitor feature is intended to help protect the processor in the unlikely event that
an application exceeds the TDP recommendation for a sustained period of time. For more details
on the usage of this feature, refer to Section 6.2. To ensure maximum flexibility for future
requirements, systems should be designed to the Fixed Mobile Solution (FMS) guidelines, even if a
processor with a lower thermal dissipation is currently planned. In all cases, the Intel Thermal
Monitor feature must be enabled for the processor to remain within specification.