Mobile Intel Pentium 4 Processor with 533 MHz Front Side Bus

40 Mobile Intel

Pentium

4 Processor with 533 MHz System Bus Datasheet

Package Mechanical Specifications

3.1 Package Load Specifications

Table 18 provides dynamic and static load specifications for the processor IHS. These mechanical

load limits should not be exceeded during heatsink assembly, mechanical stress testing, or standard

drop and shipping conditions. The heatsink attach solutions must not induce continuous stress onto

the processor with the exception of a uniform load to maintain the heat sink-to-processor thermal

interface contact. It is not recommended to use any portion of the processor substrate as a

mechanical reference or load bearing surface for thermal solutions.

Table 18. Package Dynamic and Static Load Specifications

NOTES:

1. This specification applies to a uniform compressive load.

2. This is the maximum static force that can be applied by the heatsink and clip to maintain the heatsink and

processor interface.

3. Dynamic loading specifications are defined assuming a maximum duration of 11 ms and 200 lbf is achieved

by superimposing a 100-lbf dynamic load (1 lbm at 50 g) on the static compressive load.

3.2 Processor Insertion Specifications

The mobile Intel Pentium 4 processor with 533 MHz FSB can be inserted and removed 15 times

from a mPGA478B socket meeting the Intel Pentium 4 processor 478-Pin (mPGA478B) Socket

Design Guidelines document.

3.3 Processor Mass Specifications

Table 19 specifies the processor’s mass. This includes all components which make up the entire

processor product.

Table 19. Processor Mass

Parameter Max Unit Notes

Static 100 lbf 1, 2

Dynamic 200 lbf 1, 3

Processor Mass (grams)

Intel Pentium 4 processor with 512-kB L2 Cache on

0.13 micron process