Mobile Intel Pentium 4 Processor with 533 MHz Front Side Bus

Mobile Intel
®
Pentium
®
4 Processor with 533 MHz System Bus Datasheet 3
Contents
Contents
1 Introduction......................................................................................................................................9
1.1 Terminology ........................................................................................................................10
1.2 References .........................................................................................................................12
1.3 State of Data.......................................................................................................................12
2 Electrical Specifications.................................................................................................................13
2.1 FSB and GTLREF...............................................................................................................13
2.2 Power and Ground Pins......................................................................................................13
2.3 Decoupling Guidelines........................................................................................................13
2.3.1 VCC
Decoupling ....................................................................................................14
2.3.2 FSB GTL+ Decoupling...........................................................................................14
2.4 Voltage Identification ..........................................................................................................14
2.4.1 Enhanced Intel SpeedStep® Technology..............................................................16
2.4.2 Phase Lock Loop (PLL) Power and Filter ..............................................................16
2.4.3 Catastrophic Thermal Protection ...........................................................................17
2.5 Signal Terminations, Unused Pins, and TESTHI[10:0].......................................................18
2.6 FSB Signal Groups .............................................................................................................19
2.7 Asynchronous GTL+ Signals ..............................................................................................21
2.8 Test Access Port (TAP) Connection ...................................................................................21
2.9 FSB Frequency Select Signals (BSEL[1:0]) .......................................................................21
2.10 Maximum Ratings ...............................................................................................................22
2.11 Processor DC Specifications ..............................................................................................22
2.11.1 Fixed Mobile Solution (FMS)..................................................................................22
2.12 VCC Overshoot Specification .............................................................................................31
2.12.1 Die Voltage Validation ...........................................................................................32
2.13 GTL+ FSB Specifications....................................................................................................33
3 Package Mechanical Specifications ..............................................................................................35
3.1 Package Load Specifications..............................................................................................40
3.2 Processor Insertion Specifications......................................................................................40
3.3 Processor Mass Specifications...........................................................................................40
3.4 Processor Materials ............................................................................................................41
3.5 Processor Markings ............................................................................................................41
3.6 Processor Pin-Out ..............................................................................................................41
4 Pin Listing and Signal Definitions ..................................................................................................43
4.1 Mobile Intel Pentium 4 Processor Pin Assignments ...........................................................43
4.2 Alphabetical Signals Reference..........................................................................................57
5 Thermal Specifications and Design Considerations ......................................................................65
5.1 Processor Thermal Specifications ......................................................................................65
5.1.1 Thermal Specifications ..........................................................................................65
5.1.2 Measurements for Thermal Specifications.............................................................66
5.1.2.1 Processor Case Temperature Measurement.........................................66
5.2 Processor Thermal Features ..............................................................................................67
5.2.1 Intel Thermal Monitor.............................................................................................67
5.2.2 On-Demand Mode .................................................................................................68