Mobile Intel Pentium 4 Processor Supporting Hyper-Threading Technology on 90-nm Process Technology

Mobile Intel® Pentium® 4 Processor Supporting Hyper-Threading Technology on 90-nm Process Technology Datasheet 73
Debug Tools Specifications
7 Debug Tools Specifications
Please refer to the appropriate platform design guidelines for information regarding debug tools
specifications. The ITP700 Debug Port Design Guide is located on http://developer.intel.com.
7.1 Logic Analyzer Interface (LAI)
Intel is working with two logic analyzer vendors to provide logic analyzer interfaces (LAIs) for use
in debugging processor systems. Tektronix and Agilent should be contacted to obtain specific
information about their logic analyzer interfaces. The following information is general in nature.
Specific information must be obtained from the logic analyzer vendor.
Due to the complexity of mobile processor systems, the LAI is critical in providing the ability to
probe and capture front side bus signals. There are two sets of considerations to keep in mind when
designing a processor system that can make use of an LAI: mechanical and electrical.
7.1.1 Mechanical Considerations
The LAI is installed between the processor socket and the mobile processor. The LAI pins plug
into the socket, while the processor pins plug into a socket on the LAI. Cabling that is part of the
LAI egresses the system to allow an electrical connection between the processor and a logic
analyzer. The maximum volume occupied by the LAI, known as the keepout volume, as well as the
cable egress restrictions, should be obtained from the logic analyzer vendor. System designers must
make sure that the keepout volume remains unobstructed inside the system. Note that it is possible
that the keepout volume reserved for the LAI may differ from the space normally occupied by the
processor heatsink. If this is the case, the logic analyzer vendor will provide a cooling solution as
part of the LAI.
7.1.2 Electrical Considerations
The LAI will also affect the electrical performance of the front side bus; therefore, it is critical to
obtain electrical load models from each of the logic analyzers to be able to run system level
simulations to prove that their tool will work in the system. Contact the logic analyzer vendor for
electrical specifications and load models for the LAI solution they provide.
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