Mobile Intel Pentium 4 Processor Supporting Hyper-Threading Technology on 90-nm Process Technology

60 Mobile Intel® Pentium® 4 Processor Supporting Hyper-Threading Technology on 90-nm Process Technology Datasheet
Thermal Specifications and Design Considerations
requirements, systems should be designed to the Fixed Mobile Solution (FMS) guidelines, even if a
processor with a lower thermal dissipation is currently planned. In all cases, the Intel Thermal
Monitor or Intel Thermal Monitor 2 feature must be enabled for the processor to remain
within specification.
NOTES:
1. TDP should be used for processor thermal solution design targets. The TDP is not the maximum power that
the processor can dissipate.
2. FMS, or Fixed Mobile Solution guidelines provide a design target for meeting future thermal requirements.
5.1.2 Thermal Metrology
The maximum and minimum case temperatures (T
C
) are specified in Table 5-1. These temperature
specifications are meant to help ensure proper operation of the processor. Figure 5-1 illustrates
where Intel recommends T
C
thermal measurements should be made.
Table 5-1. Processor Thermal Specifications
Processor
Number
Core Frequency
(GHz)
Thermal Design
Power (W)
Minimum T
C
(°C)
Maximum T
C
(°C)
Notes
518 2.80 88 5 75 1
532 3.06 88 5 75 1
538 3.20 88 5 75 1
548 3.33 88 5 75 1
552 3.46 88 5 75 1
FMS0.5 94 5 76 1, 2
Figure 5-1. Case Temperature (T
C
) Measurement Location
31 mm x 31 mm IHS [1.22 x 1.22 in]
35 mm x 35 mm substrate [1.378 in x 1.378 in]
Measure T
C
at this point
(geometric center of IHS)
Measure from edge of processor IHS
15.5 mm [.61 in]
15.5 mm [.61 in]