Mobile Intel Pentium 4 Processor Supporting Hyper-Threading Technology on 90-nm Process Technology

4 Mobile Intel® Pentium® 4 Processor Supporting Hyper-Threading Technology on 90-nm Process Technology Datasheet
5.2.3 On-Demand Mode.................................................................................. 63
5.2.4 PROCHOT# Signal Pin .......................................................................... 63
5.2.5 THERMTRIP# Signal Pin ....................................................................... 64
5.2.6 Tcontrol and Fan Speed Reduction ....................................................... 64
5.2.7 Thermal Diode........................................................................................ 64
6 Features ........................................................................................................................... 67
6.1 Power-On Configuration Options ........................................................................ 67
6.2 Clock Control and Low Power States.................................................................. 67
6.2.1 Normal State—State 1 ........................................................................... 67
6.2.2 AutoHALT Power-Down State—State 2................................................. 68
6.2.3 Stop-Grant State—State 3 ..................................................................... 68
6.2.4 HALT/Grant Snoop State—State 4 ........................................................ 69
6.2.5 Sleep State—State 5.............................................................................. 69
6.2.6 Deep Sleep State—State 6 .................................................................... 70
6.2.7 Deeper Sleep State—State 7 ................................................................. 70
6.3 Enhanced Intel SpeedStep® Technology ........................................................... 70
7 Debug Tools Specifications.............................................................................................. 73
7.1 Logic Analyzer Interface (LAI)............................................................................. 73
7.1.1 Mechanical Considerations .................................................................... 73
7.1.2 Electrical Considerations........................................................................ 73