Mobile Intel Pentium 4 Processor Supporting Hyper-Threading Technology on 90-nm Process Technology

Mobile Intel® Pentium® 4 Processor Supporting Hyper-Threading Technology on 90-nm Process Technology Datasheet 3
Contents
1 Introduction.........................................................................................................................7
1.1 Terminology........................................................................................................... 8
1.1.1 Processor Packaging Terminology........................................................... 8
1.2 References ............................................................................................................9
2 Electrical Specifications....................................................................................................11
2.1 Power and Ground Pins ......................................................................................11
2.2 Decoupling Guidelines ........................................................................................ 11
2.2.1 Vcc Decoupling ......................................................................................11
2.2.2 Front Side Bus GTL+ Decoupling...........................................................11
2.2.3 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking................... 11
2.3 Voltage Identification ...........................................................................................12
2.3.1 Phase Lock Loop (PLL) Power and Filter...............................................14
2.4 Reserved, Unused, and TESTHI Pins................................................................. 15
2.5 Front Side Bus Signal Groups............................................................................. 15
2.6 Asynchronous GTL+ Signals...............................................................................17
2.7 Test Access Port (TAP) Connection.................................................................... 17
2.8 Front Side Bus Frequency Select Signals (BSEL[1:0]) .......................................18
2.9 Absolute Maximum and Minimum Ratings .......................................................... 18
2.10 Processor DC Specifications...............................................................................19
2.10.1 Fixed Mobile Solution (FMS) ..................................................................19
2.11 VCC Overshoot Specification..............................................................................25
2.11.1 Die Voltage Validation ............................................................................ 26
3 Package Mechanical Specifications .................................................................................27
3.1 Package Mechanical Specifications ....................................................................27
3.1.1 Package Mechanical Drawing ................................................................ 28
3.1.2 Processor Component Keep-Out Zones ................................................31
3.1.3 Package Loading Specifications ............................................................ 31
3.1.4 Package Handling Guidelines ................................................................ 31
3.1.5 Package Insertion Specifications ...........................................................32
3.1.6 Processor Mass Specification ................................................................ 32
3.1.7 Processor Materials................................................................................ 32
3.1.8 Processor Markings................................................................................ 32
3.1.9 Processor Pin-Out Coordinates.............................................................. 33
4 Pin Listing and Signal Descriptions ..................................................................................35
4.1 Processor Pin Assignments ................................................................................ 35
4.2 Alphabetical Signals Reference ..........................................................................50
5 Thermal Specifications and Design Considerations......................................................... 59
5.1 Processor Thermal Specifications.......................................................................59
5.1.1 Thermal Specifications ...........................................................................59
5.1.2 Thermal Metrology .................................................................................60
5.2 Processor Thermal Features............................................................................... 61
5.2.1 Intel Thermal Monitor .............................................................................61
5.2.2 Thermal Monitor 2 ..................................................................................61