Mobile Intel Pentium 4 Processor Supporting Hyper-Threading Technology on 90-nm Process Technology

Mobile Intel® Pentium® 4 Processor Supporting Hyper-Threading Technology on 90-nm Process Technology Datasheet 27
Package Mechanical Specifications
3 Package Mechanical
Specifications
3.1 Package Mechanical Specifications
The Mobile processor is packaged in a Flip-Chip Pin Grid Array (FC-mPGA4) package that
interfaces with the motherboard via a mPGA479 socket. The package consists of a processor core
mounted on a substrate pin carrier. An integrated heat spreader (IHS) is attached to the package
substrate and core and serves as the mating surface for processor component thermal solutions,
such as a heatsink. Figure 3-1 shows a sketch of the processor package components and how they
are assembled together. Refer to the mPGA479, mPGA478A, mPGA478B, mPGA478C, and
mPGA476 Socket Design Guidelines for complete details on the mPGA479 socket.
The package components shown in Figure 3-1 include the following:
1. Integrated Heat Spreader (IHS)
2. Thermal Interface Material (TIM)
3. Processor core (die)
4. Package substrate
5. Capacitors
NOTE: Socket and motherboard are included for reference and are not part of processor package.
Figure 3-1. Processor Package Assembly Sketch
SOCKET
SUBSTRATE
IHS
CAPACITORS
CORE (DIE)
MOTHERBOARD
TIM
SOCKET
SUBSTRATE
IHS
CAPACITORS
CORE (DIE)
MOTHERBOARD
TIM
TIM
SUBSTRATE
SOCKET
CAPACITORS
IHS
MOTHERBOARD
CORE (DIE)