Guidelines
Table Of Contents
- 1 Introduction
- 2 Packaging Technology
- 3 Thermal Specifications
- 4 Thermal Simulation
- 5 Thermal Metrology
- 6 Reference Thermal Solution
- A Thermal Solution Component Suppliers
- B Mechanical Drawings
Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide 37
Reference Thermal Solution
6.4.1 Extruded Heatsink Profiles
The reference thermal solution uses an extruded heatsink for cooling the chipset MCH.
Figure 6-3 shows the heatsink profile. Other heatsinks with similar dimensions and
increased thermal performance may be available. A full mechanical drawing of this
heatsink is provided in Appendix B.
Figure 6-2. Design Concept for Reference Thermal Solution
Figure 6-3. Heatsink Extrusion Profiles