Datasheet
R
Datasheet 7
5.4.2
3D Engine ...........................................................................................181
5.4.3
Raster Engine ..................................................................................... 186
5.4.4
GMCH 2D Engine ...............................................................................189
5.4.5
GMCH Planes and Engines................................................................190
5.4.6
Hardware Cursor Plane ......................................................................190
5.4.7
Overlay Plane ..................................................................................... 191
5.4.8
Video Functionality..............................................................................192
5.5
Display Interface.................................................................................................193
5.5.1
Analog Display Port Characteristics ...................................................193
5.5.2
Digital Display Interface ......................................................................194
5.6
AGP Interface Overview.....................................................................................199
5.6.1
AGP Target Operations ......................................................................199
5.6.2
AGP Transaction Ordering ................................................................. 200
5.6.3
AGP Signal Levels..............................................................................200
5.6.4
4X AGP Protocol.................................................................................201
5.7
Power and Thermal Management......................................................................204
5.8
General Description of Supported CPU States..................................................205
5.9
General Description of ACPI States...................................................................205
5.10
Enhanced Intel SpeedStep
®
Technology Overview...........................................206
5.11
External Thermal Sensor Input...........................................................................206
6
Electrical Characteristics.................................................................................................209
6.1
Absolute Maximum Ratings................................................................................209
6.2
Thermal Characteristics .....................................................................................210
6.3
Power Characteristics ........................................................................................211
6.4
Signal Groups.....................................................................................................213
6.5
DC Characteristics .............................................................................................216
7
Testability ........................................................................................................................225
7.1
XOR Chain Differential Pairs..............................................................................225
7.2
XOR Chain Exclusion List ..................................................................................226
7.3
XOR Chain Connectivity/Ordering .....................................................................227
7.4
VCC/VSS Voltage Groups..................................................................................238
7.5
Power Sequence Recommendation...................................................................239
8
Intel
®
852GME GMCH and 852PM MCH Strap Pins...................................................... 241
8.1
Strapping Configuration Table............................................................................241
9
Ballout and Package Information....................................................................................243
9.1
Package Mechanical Information.......................................................................278