Datasheet

Ballout and Package Information
R
278 Datasheet
9.1 Package Mechanical Information
The following figures provide details on the package information and dimensions of the Intel
®
852GME GMCH and Intel 852PM MCH chipsets. The GMCH/MCH comes in a Micro-FCBGA
package similar to the mobile processors. The package consists of a silicon die mounted face
down on an organic substrate populated with solder balls on the bottom side. Capacitors may be
placed in the area surrounding the die. Because the die-side capacitors are electrically conductive,
and only slightly shorter than the die height, care should be taken to avoid contacting the
capacitors with electrically conductive materials. Doing so may short the capacitors and possibly
damage the device or render it inactive. The use of an insulating material between the capacitors
and any thermal solution should be considered to prevent capacitor shorting. An exclusion, or
keepout area, surrounds the die and capacitors, and identifies the contact area for the package.
Care should be taken to avoid contact with the package inside this area.
Figure 16. Intel
®
852GME GMCH and Intel
®
852PM MCH Micro-FCBGA Package Dimensions
(Top View)