Datasheet
R
8 Datasheet
6.5.2.7.1
Panel Power Sequence States..........................156
6.5.2.8
Back Light Inverter Control................................................157
6.5.2.9
Digital Video Output Port...................................................157
6.5.2.10
Intel 855GME GMCH AGP Interface Overview................. 158
6.5.2.11
AGP Target Operations.....................................................158
6.5.3
AGP Transaction Ordering .................................................................159
6.5.4
AGP Signal Levels.............................................................................. 159
6.5.5
4X AGP Protocol.................................................................................159
6.5.5.1
Fast Writes ........................................................................160
6.5.5.2
AGP FRAME# Transactions on AGP................................ 160
6.5.6
Concurrent and Simultaneous Display ............................................... 163
7
Power and Thermal Management...................................................................................165
7.1
General Description of Supported CPU States..................................................165
7.2
7.2. General Description of ACPI States............................................................166
7.3
Enhanced Intel SpeedStep
®
Technology Overview...........................................167
7.4
Internal Thermal Sensor..................................................................................... 167
7.4.1
Overview.............................................................................................167
7.4.2
Hysteresis Operation ..........................................................................167
7.5
External Thermal Sensor Input...........................................................................167
7.5.1
Usage..................................................................................................168
8
Electrical Characteristics.................................................................................................169
8.1
Absolute Maximum Ratings................................................................................169
8.2
Thermal Characteristics .....................................................................................170
8.3
Power Characteristics ........................................................................................171
8.4
Signal Groups.....................................................................................................172
8.5
DC Characteristics .............................................................................................176
8.5.1
General DC Characteristics................................................................ 176
8.5.2
DAC DC Characteristics .....................................................................183
8.5.3
DAC Reference and Output Specifications ........................................184
9
Video Filter Capacitors and Ferrite Bead Arranged in a PI Configuration (One PI Filter
Testability).......................................................................................................................185
9.1
XOR Test Mode Entry ........................................................................................186
9.2
XOR Chain Differential Pairs..............................................................................187
9.3
XOR Chain Exclusion List ..................................................................................187
9.4
XOR Chain Connectivity/Ordering .....................................................................188
9.4.1
VCC/VSS Voltage Groups..................................................................200
10
Intel
®
855GM/GME GMCH Strap Pins............................................................................ 201
10.1
Strapping Configuration......................................................................................201
11
Ballout and Package Information....................................................................................203
11.1
Package Mechanical Information.......................................................................211