Datasheet

Electrical Characteristics
R
170 Datasheet
Symbol Parameter Min Max Unit Notes
VCCAHPLL,
VCCAGPLL,
VCCADPLLA,
VCCADPLLB
Power supply for the Host PLL, Power Supply for the
Hub PLL, Power supply for the Display PLL A, Power
supply for the Display PLL B, respectively
-0.3 1.65 V
Intel 855GME GMCH Only
VCC 1.35 V Core Supply Voltage with respect to VSS -0.3 1.65 V
VCCHI 1.35 V Hub Interface Supply Voltage with respect to
VSS
-0.3 1.65 V
VCCASM
(DDR333
SDRAM)
1.35 V DDR SDRAM System Memory Logic Supply
Voltage (not connected to Core) with respect to VSS
-0.3 1.65 V
VCCAHPLL,
VCCAGPLL,
VCCADPLLA,
VCCADPLLB
Power supply for the Host PLL, Power Supply for the
Hub PLL, Power supply for the Display PLL A, Power
supply for the Display PLL B, respectively
-0.3 1.65 V
NOTES:
1. Functionality is not guaranteed for parts that exceed Tdie temperature above 105 °C. Full performance
may be affected if the on-die thermal sensor is enabled. Please refer to the Intel®
852GM/855GM/855GME Chipset Mobile Thermal Design Guide for supplementary details.
2. Possible damage to the GMCH may occur if the GMCH temperature exceeds 150 °C. Intel does not
guarantee functionality for parts that have exceeded temperatures above 150 °C due to spec
violation.
8.2 Thermal Characteristics
The Intel 855GM/855GME GMCH is designed for operation at die temperatures between 0°C and
105 °C. The thermal resistance of the package is given in Table 44.
Table 44. Intel
®
855GM/855GME GMCH Package Thermal Resistance
Parameter Airflow Velocity in Meters/Second
0 m/s 1 m/s
Ψ
jt
(°C/Watt)** 0.5 1.8
Θ
ja
(°C/Watt)** 20.0 17.3
NOTE: ** Estimate