Datasheet

Datasheet, Volume 2 27

Introduction
1.2 Related Documents
Refer to the following documents for additional information.
SMBus
System Management Bus. A two-wire interface through which simple system and
power management related devices can communicate with the rest of the
system. It is based on the principals of the operation of the I
2
C* two-wire serial
bus from Philips Semiconductor.
SSE Intel
®
Streaming SIMD Extensions (Intel
®
SSE)
Storage Conditions
A non-operational state. The processor may be installed in a platform, in a tray,
or loose. Processors may be sealed in packaging or exposed to free air. Under
these conditions, processor landings should not be connected to any supply
voltages, have any I/Os biased or receive any clocks. Upon exposure to “free air”
(that is, unsealed packaging or a device removed from packaging material) the
processor must be handled in accordance with moisture sensitivity labeling
(MSL) as indicated on the packaging material.
TAC Thermal Averaging Constant
TDP Thermal Design Power
Uncore The portion of the processor comprising the shared cache, IMC, and IIO.
Unit Interval
Signaling convention that is binary and unidirectional. In this binary signaling,
one bit is sent for every edge of the forwarded clock, whether it be a rising edge
or a falling edge. If a number of edges are collected at instances t
1
, t
2
, t
n
,...., t
k
then the UI at instance “n” is defined as:
UI
n
= t
n
- t
n
- 1
UR Unsupported Requests
V
CC
Processor core power supply
V
SS
Processor ground
x1 Refers to a Link or Port with one Physical Lane
x16 Refers to a Link or Port with sixteen Physical Lanes
x4 Refers to a Link or Port with four Physical Lanes
x8 Refers to a Link or Port with eight Physical Lanes
Table 1-1. Processor Terminology (Sheet 3 of 3)
Term Description
Table 1-2. Processor Documents (Sheet 1 of 2)
Document
Document Number/
Location
Intel
®
Core™ i7 Processor Family for the LGA-2011 Socket Datasheet, Volume
1
326196
Desktop Intel
®
Core™ i7 Processor Family for the LGA-2011 Thermal
Mechanical Specification and Design Guide
326199
Intel
®
Core™ i7 Processor Family for the LGA-2011 Socket Specification Update
326198
Intel
®
X79 Express Chipset Datasheet
326200
Intel
®
X79 Express Chipset Thermal Mechanical Specifications and Design
Guide
326202
Advanced Configuration and Power Interface Specification 3.0 http://www.acpi.info
PCI Local Bus Specification http://www.pcisig.com/
specifications
PCI Express
®
Base Specification http://www.pcisig.com
DDR3 SDRAM Specification http://www.jedec.org