User's Manual
Table Of Contents
- 1.0 General Device Overview
- 2.0 Basic Operating Information
- 3.0 eUniStone Interfaces
- 4.0 General Device Capabilities
- 5.0 Bluetooth Capabilities
- 6.0 Electrical Characteristics
- 7.0 Package Information
- 8.0 Bluetooth Qualification and Regulatory Certification
- 8.1 Reference Design
- 8.2 FCC Class B Digital Devices Regulatory Notice
- 8.3 FCC Wireless Notice
- 8.4 FCC Interference Statement
- 8.5 FCC Identifier
- 8.6 European R&TTE Declaration of Conformity
- 8.7 Bluetooth Qualified Design ID
- 8.8 Industry Canada Certification
- 8.9 Label Design of the Host Product
- 8.10 Regulatory Test House
- 9.0 Assembly Guidelines
- References
- Terminology
eUniStone
PBA 31309
Assembly Guidelines
User’s Manual Intel Public 41
Hardware Description Revision 1.0, 1-Feb-2013
9.5 Soldering Profile
Generally all standard reflow soldering processes (vapour phase, convection, infrared)
and typical temperature profiles used for surface mount devices are suitable for the
eUniStone module. Wave soldering is not possible.
Figure 17 and Figure 18 shows example of a suitable solder reflow profile. One for
leaded and one for leadfree solder.
Figure 17. Eutectic Lead-Solder Profile
Figure 18. Eutectic Leadfree-Solder Profile
Lead_Solder_Profile .vsd
Recommended temp. profile
for reflow soldering
Tem
p
.
[
°C
]
Time [s]
235°C max.
220
5°C
200°C
150
10°C
90
30s
10
1s
30 +20/-10s
LeadFree_Solder_Profile.vsd
25°C
150°C
200°C
217°C
255°C
260°C
60 ~ 120 sec @ 3’C/sec max
60 ~ 150 sec
30 sec
max
6’C/sec
max
8 minutes max
Temp.[°C]
Time [s]
Recommended temp. profile
for reflow soldering (J-STD-020C)