Specifications

January 13, 2021
Page 18/31
Document Ref: isp_lora_DS4520_R7
Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com
LoRa / BLE MODULE
ISP4520
4.2. SMT Assembly Guidelines
For PCB Land Patterns and Solder Mask layout, Insight SiP recommends the use of the same
dimensions as the module pads, i.e. 0.65 x 0.30 mm for standard pads, 0.70 x 0.70 mm for corner pads,
2.75 x 2.15 mm for mechanical pads.
Please contact Insight SiP for more detailed information.
4.3. Antenna Keep-Out Zone
For optimal antenna performance, it is recommended to respect a metal exclusion zone to the edge of
the board: no metal, no traces and no components on any application PCB layer except mechanical LGA
pads.