Datasheet
Data Sheet 68 Rev. 1.1, 2009-01-19
TLE 7241E
Package Outlines
7 Package Outlines
Exposed Diepad
Index Marking
1) Does not include plastic or metal protrusion of 0.15 max. per side
2) Does not include dambar protrusion of 0.05 max. per side
Index Marking
Ejector Mark
Ejector Mark
1
10
10
5.2
1
20 11
4.6
Bottom View
11 20
1.27
±0.08
0.4
2)
A-B0.25
M
20x
CD
20x
C
C
0.1
0...0.10
-0.2
2.45
2.6 MAX.
-0.2
7.6
1)
0.35 x 45°
0.7
±0.2
10.3
±0.3
+0.09
0.23
8° MAX.
A
D
1)
12.8
-0.2
B
PG-DSO-20-27-PO V14
Figure 31 PG-DSO-20-27 EDP(Plastic Dual Small Outline Exposed Die Pad)
You can find all of our packages, sorts of packing and others in our
Infineon Internet Page “Products”: http://www.infineon.com/products.
Dimensions in m
m
Green Product (RoHS-compliant)
To meet the world-wide customer requirements for environmentally friendly
products and to be compliant with government regulations the device is
available as a green product. Green products are RoHS-Compliant (i.e Pb-free
finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-
STD-020).










