Datasheet

Data Sheet 6 Rev. 1.1, 2008-02-26
TLE4294
General Product Characteristics
4.3 Thermal Resistance
Pos. Parameter Symbol Limit Values Unit Conditions
Min. Typ. Max.
4.3.1 Junction to Ambient
1)
1) Not subject to production test, specified by design
R
thJA
– 179 – K/W Footprint only
2)
2) EIA/JESD 52_2, FR4, 80 × 80 × 1.5 mm; 35μ Cu, 5μ Sn
4.3.2 – 99 – K/W 300mm
2
heatsink
area on PCB
2)
4.3.3 – 87 – K/W 600mm
2
heatsink
area on PCB
2)
4.3.4 – 80 – K/W 2s2p PCB
3)
3) Specified R
thJA
value is according to JEDEC JESD51-2,-5,-7 at natural convection on FR4 2s2p board; The product
(chip+package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70μm Cu, 2 x 35μm Cu).
4.3.5 Junction to Soldering Point
1)
R
thJSP
– 26 – K/W Measured to pin 5