Datasheet

TLE42744
General Product Characteristics
Data Sheet 8 Rev. 1.1, 2010-01-13
TLE42744EV50 (PG-SSOP-14 exposed pad)
4.3.11 Junction to Case
1)
R
thJC
– 7 – K/W measured to
exposed pad
4.3.12 Junction to Ambient
1)
R
thJA
–43–K/W
2)
4.3.13 – 120 – K/W footprint only
3)
4.3.14 – 59 – K/W 300 mm² heatsink
area
3)
4.3.15 – 49 – K/W 600 mm² heatsink
area
3)
TLE42744GSV33 (PG-SOT223-4)
4.3.16 Junction to Case
1)
R
thJC
– 17 – K/W measured to heat
slug
4.3.17 Junction to Ambient
1)
R
thJA
–54–K/W
2)
4.3.18 – 139 – K/W footprint only
3)
4.3.19 – 73 – K/W 300 mm² heatsink
area
3)
4.3.20 – 64 – K/W 600 mm² heatsink
area
3)
1) Not subject to production test, specified by design.
2) Specified
R
thJA
value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board; The Product
(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm³ board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu).
Where applicable a thermal via array under the exposed pad contacted the first inner copper layer.
3) Specified
R
thJA
value is according to Jedec JESD 51-3 at natural convection on FR4 1s0p board; The Product
(Chip+Package) was simulated on a 76.2 × 114.3 × 1.5 mm
3
board with 1 copper layer (1 x 70µm Cu).
Pos. Parameter Symbol Limit Values Unit Conditions
Min. Typ. Max.